GLAST: Program of work.
Collaboration between Material Engineer of Terni, INFN of Perugia and CERN


*The program has been carried out in various centers.

October-December 2000-PISA
Collaboration to the realization of the prototype's project of the tray to send to the industries and creation of tools for the probe and micro bonding of the laboratory of Pisa.

January 2001- CERN
Organization for thermal tests on adhesives and trays, selection of the instruments to guarantee adequate DAQ for the thermal test in climatic room.

Planarity and parallelism errors measurement on the tray produced by Alenia

List of adhesive to test:
NUSIL CV-1142-1 silicon adhesive
NUSIL CV-2646 silicon conductive adhesive
EPO-TEK EP-410_LV epoxy conductive adhesive
Dow Corning 3145 RTV silicon adhesive.

Test on TMA (Thermal-Mechanical Analyzer) to determinate the thermal coefficient of adhesives vs. temperature. Analysis of the epoxy adhesives on a range of temperature 25°C-100°C, for the silicon adhesives 25°C-250°C.

19/04/01 CERN
Mechanical properties: standard test conform to ASTM D1002-94 for determination of shear modulus and shear strength of adhesives

25/04/01 CERN
Rheology of adhesive: DSC Analysis
Analysis performed to measure the glass and cure temperature, gel time and the general changing in the properties of the thermoset adhesives.
Test program:
a) Thermal test on non-cured adhesives to determine the general thermal property.
b) Isothermal test on glass transition temperature to determine the time of gel
c) Thermal ramped test on cured adhesives to analyze the post polymerization.
The range of temperature for epoxy adhesive is 30°C-100°C and for silicon adhesives is -30°C-250°C.


28/03/01- 02/04/01 Terni
Verification of DAQ on the climatic room and performing thermal tests on aluminum plaques and on Agile`s tray. Collaboration with INFN of Bari and Perugia.
The DAQ consist in a National Instrument Card and a Lab Views program created by INFN of Bari for the acquisition of temperature and deformations in real time on the climatic room.
Problem is the temperature compensation of strain gages during the thermal cycle.
Solution is the creation of Whetstone Bridge for every measurement fixing a gage on a indeformable temperature material.
Verifying that the noise on the circuit doesn't create problem to the precision of the measure.
Positioning of strain gages on the trays. Study of the correct way of gluing and welding the poles of the gauges.
Analysis of the thermal flux and measurement of temperature in real time in the climatic room via thermocouples.

April 2001- CERN
Verification of the thermal experimental results obtained on the Agile`s tray.
Production of the tray's support for the trays on the climatic room to use during the thermal test (INVAR or marble).
Collaboration to the production of a vacuum-box to insert in the climatic room.
Production will be done at the workshop of INFN of Perugia.
Creation of a data acquisition with laser or capacitive sensors to measure the bending or out of plane deformations of the trays during thermal tests.

May 2001- TERNI
Thermal test on trays on the complete moke-ups produced by Plyform.